He is leading R&D of semiconductor, substrate and display materials at Showa Denko. In addition, he is head of packaging solution center, which is open innovation hub in advanced packaging development. He launched JOINT2, new advanced packaging consortium targeting 2.xD and 3D package in 2021.

Prior to current mission, Hidenori Abe has been a General Manager of CMP slurry business sector for three years. Before that Abe was a manager of Marketing Promotion group in Innovation Promotion Center at Hitachi Chemical for 2 years with responsibility to propose new R&D projects, especially targeting new business field for Hitachi Chemical using new technology, and also to promote developing R&D products. Abe was manager of business development group in packaging solution center at Hitachi Chemical for 1 year with responsibility to promote open laboratory to partners such as customers and equipment makers, responsibility of marketing wearable related materials. Before that, Abe was molding compounds engineer at Hitachi Chemical. During his 16 years carrier as molding compounds engineer, Abe spent time doing responsibility of development of non-conductive carbon, Green molding compounds, Cu wire compatible molding compounds, wafer level compression compounds, power module molding compounds and so on. His Cu wire compatible molding compounds development work contributed to the promotion to Cu wire conversion through several published papers.

Abe received a master degree in chemical engineering field from Tokyo institute of technology, Japan and a master degree at the EMBA course from Oxford, UK.