Dr. Raja Swaminathan is CVP, Advanced Packaging instrumental in the development of AMD’s industry leading advanced packaging roadmap. Raja has been a leader in silicon-package-system architecture definition and a co-design expert with extensive experience introducing new technologies and innovation across the silicon-packaging spectrum at Intel, Apple and AMD. He’s helped enable PPAC (power, performance, area, and cost) improvements as well as introduction of novel heterogeneous architectures throughout his career: EMIB, Apple’s Mx package architectures, 3D V-Cache, Elevated Fan-Out Bridge, High Performance Fanout to name a few. Raja received his Bachelors’ from IIT Madras and PhD from Carnegie Mellon University and has over 40 US patents in the field. He is an IEEE Senior Member and is on the technical advisory board for the Semiconductor research corporation (SRC) and Deca Technologies.