Mark Fuselier is senior vice president of Technology and Product Engineering at AMD. He is responsible for silicon and packaging technology development and new product introduction engineering. Fuselier has more than 27 years of semiconductor industry experience and has been involved in the development and production of process technology generations spanning from 35 micron through 3nm across multiple fabs and product families. He played a central role in the development and productization of computing solutions such as multi-core CPU and GPU SoC integration, heterogenous APUs, 2.5D and 3D chip- packaging, and chiplet System in Package (SiP) integration. Fuselier holds a Master of Science degree in electrical engineering and Master of Business Administration from the University of Texas at Austin. He is a member of IEEE and the Electron Devices Society.

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