Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.