Dr Yun Zhang, founder and CEO of Shinhao Materials LLC, has been active in materials innovation, R&D, marketing and sales for over 28 years, holding 34 granted patents, and numerous peer-reviewed journal publications and awards. She started her career at AT&T Bell labs in 1994, carrying out materials research and development. Her work on tin whisker growth won international recognition for demonstrating experimentally for the first time its driving force and for developing mitigation solutions. In 2002, she was appointed global R&D director by Cookson Electronics Enthone for its electronics business. In the subsequent 10 years, her insight and leadership in fundamental understanding of electrodeposition process at a molecule level, combined with a deep appreciation of technology trends and customer needs has won Dr. Zhang many friends and willing partners at top tier equipment manufacturers and key customers. Those close and collaborative partnerships resulted in win-win to all parties for RDL, copper pillar and TSV plating. She received a BS in chemistry from Nanjing University, and a PhD in chemistry from Brown University.
Previously we have demonstrated that electroplated copper could be engineered to have microstructures at um and nm scales. This paper shows that not all nanograined copper is created equal. Through systematic investigations, significant insight is obtained into the necessary conditions to create a stable nanograined copper that meets the following criteria: 1. microstructure stable over 9 months at ambient storage conditions, 2. textures of the electrodeposited copper do not depend on substrate types and their textures, 3. grain growth increases to micron scale at temperatures above 150 C. Furthermore, we shall introduce a concept of nanograin threshold in the context of RT microstructure stability.