Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package, MEMS/Sensor and Memory product development. Curtis is Past General Chair for the IMAPS Symposium on Microelectronics 2019 and serves on the IMAPS Executive Council as Director of Membership. He has authored numerous technical articles and papers and co-authored a chapter in the recently released book, “Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies.” Curtis has been issued 30 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package, MEMS/Sensor and Memory product development. Curtis is Past General Chair for the IMAPS Symposium on Microelectronics 2019 and serves on the IMAPS Executive Council as Director of Membership. He has authored numerous technical articles and papers and co-authored a chapter in the recently released book, “Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies.” Curtis has been issued 30 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Today’s interconnected world has been enabled, to a large degree, by the significant advancements in semiconductor packaging. Smartphones, wearable devices, and datacenter networking systems continue to challenge the packaging community as system designers look for faster, smaller, and more integrated devices. And with the challenges come opportunities. Fortunately, advanced package development is not taking place in isolation. It benefits from advances occurring in other semiconductor technologies as well as advances in device design and simulation to improvements in wafer fabrication, product packaging, and final test. The characteristics of a revolutionary integrated circuit (IC) package platform – innovative, reliable, extendable, cost-effective, and robust – are either created or supported by these technologies. From open collaboration at industry summits to strategic engagements with supply chain partners, IC packaging challenges and opportunities are being addressed. This is an outsourced semiconductor assembly and test (OSAT) supplier’s perspective.