ISES USA 2023
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Keith
Best
Onto Innovation
Director Product Marketing
For more than 30 years, Keith Best has held a range of semiconductor processing and applications positions for both device manufacturing and capital equipment companies, of which 13 years were with ASML where he held the position of Director, Applications Engineering. Most recently, Keith was Advanced Packaging Process Development Engineering Manager at SkyWater Florida. He is currently the Director of Product Marketing at Onto Innovation supporting the JetStep® advanced packaging lithography stepper. Keith holds a B.Sc. Honors Degree in Materials Science from the University of Greenwich, UK. He has numerous publications and holds 21 US patents in the areas of photolithography and process integration.
For more than 30 years, Keith Best has held a range of semiconductor processing and applications positions for both device manufacturing and capital equipment companies, of which 13 years were with ASML where he held the position of Director, Applications Engineering. Most recently, Keith was Advanced Packaging Process Development Engineering Manager at SkyWater Florida. He is currently the Director of Product Marketing at Onto Innovation supporting the JetStep® advanced packaging lithography stepper. Keith holds a B.Sc. Honors Degree in Materials Science from the University of Greenwich, UK. He has numerous publications and holds 21 US patents in the areas of photolithography and process integration.
Upcoming Events
May 10th
|
14:20 - 14:25
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Addressing Process Control Challenges in Panel Level Processing (PLP)
The growth in advanced node die size for server and GPU applications, the desire to combine differing device node technologies and the growing need for integrated memory technologies, has accelerated the development and production trend towards chiplet based architectures. A key part of the delivery of these solutions is Panel Level Processing (PLP). Onto Innovation is a key supplier of PLP Lithography and Inspection technologies to the Advanced Packaging market today. This presentation will provide a brief introduction to the market growth drivers, an overview of the key panel level processing steps and the types of defects and manufacturing challenges faced as a result in the successful production of PLP based solutions. It will conclude with a brief introduction to the PLP hardware tools and highlight some of the key software capabilities currently offered, followed by a brief introduction to Onto Innovation.
Full Agenda
Onto Innovation
Onto Innovation stands alone in process control with our unique perspective across the semiconductor value chain. We enable our customers to solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation will optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports its customers with a worldwide sales and service organization.
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