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Mostafa Aghazadeh is Corporate Vice President of Technology Development Group, and Director of Die Prep & Assembly Technology Development at Intel Corporation. He is responsible for development and deployment of packaging assembly process, equipment, and materials technologies and all the associated suppliers. He joined Intel in 1984 and has held a variety of technical and management positions in the microelectronic packaging area. He and his team have been major contributors to development of packaging solutions, manufacturing capabilities and supply chain for Intel’s products for the past 38 years. He holds six U.S. patents. Mostafa has served on the iNEMI Board of Directors since 2013, and as chairman since 2020. Mostafa received his bachelor's degree in mechanical engineering from the University of Tennessee and a master's degree in mechanical engineering from the Georgia Institute of Technology.
Mostafa Aghazadeh is Corporate Vice President of Technology Development Group, and Director of Die Prep & Assembly Technology Development at Intel Corporation. He is responsible for development and deployment of packaging assembly process, equipment, and materials technologies and all the associated suppliers. He joined Intel in 1984 and has held a variety of technical and management positions in the microelectronic packaging area. He and his team have been major contributors to development of packaging solutions, manufacturing capabilities and supply chain for Intel’s products for the past 38 years. He holds six U.S. patents. Mostafa has served on the iNEMI Board of Directors since 2013, and as chairman since 2020. Mostafa received his bachelor's degree in mechanical engineering from the University of Tennessee and a master's degree in mechanical engineering from the Georgia Institute of Technology.
Shrinking operating margins, complex supply chains, shorter product/ lifecycles, sustainability considerations, market demands for miniaturization and advances in product development/manufacturing drives the need for global collaboration to address not only market needs but also to solve challenging technological problems in the electronics manufacturing precompetitive space. The value of such collaborations is risk minimization of technology deployment, faster development of industry infrastructure, stimulation of relevant standards development, and dissemination of efficient business practices with a reduced time to market experienced by the electronics manufacturing ecosystem. Additionally, iNEMI members leverage to their participation to develop their engineering staff and build a robust network of technical expertise along the electronics manufacturing value chain. The International Electronics Manufacturing Initiative (iNEMI) is a not-for-profit R&D consortium of leading electronics manufacturers and suppliers, along with associations, government agencies, and universities. Its mission is to be the premier collaboration forum to forecast and accelerate improvements in the electronics manufacturing industry. iNEMI roadmaps the future technology requirements of the global electronics manufacturing industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact collaborations among our members. iNEMI membership consists of leading companies, research organizations that represent the key elements of the electronics manufacturing supply chain. These companies are focused on formulating and working on technology projects in key areas like 5G/6G communications, Advanced Packaging, Smart Manufacturing, Optoelectronics, Circular economy, and Board Assembly.