Ruurd

Boomsma

Besi

CTO

Studied semiconductor physics and high vacuum technology in the Netherlands. Started working in semiconductor Industry in 1984 at ASM in front end equipment. Was at that time also involved with first sales of ASML Steppers. Later on worked at MRC in PVD and also Oerlikon/Unaxis being responsible for the materials and display groups. Started working for Besi in 2008 which included responsibility for plating and die attach product line and moved up to become the CTO of Besi.

Studied semiconductor physics and high vacuum technology in the Netherlands. Started working in semiconductor Industry in 1984 at ASM in front end equipment. Was at that time also involved with first sales of ASML Steppers. Later on worked at MRC in PVD and also Oerlikon/Unaxis being responsible for the materials and display groups. Started working for Besi in 2008 which included responsibility for plating and die attach product line and moved up to become the CTO of Besi.

Upcoming Events

May 9th

 | 

15:10 - 15:30

15:10 - 15:30

Latest Developments in High-end Advanced Packaging

Event Detail TBA

Besi

BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.

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