ISES USA 2023
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Vincent
DiCaprio
Applied Materials
VP Advanced Packaging and ICAPS & Head of Business and Corporate Development
Experienced in all facets of the technology sector, Vincent has over 30 years of outstanding achievement in Technology Development, Operations, Business, Sales and Marketing, having demonstrated success at companies like IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES. Currently leading Corporate and Business Development for the Advanced Packaging and ICAPS division at Applied Materials, he is responsible for forging new strategic alliances and partnerships key to technology advancement for future product solutions. Vincent leads all aspects of critical technology inflections related to Heterogenous Integrated, next generation integration of Silicon, volumetric scaling for all key aspects of the technology stack related to system level solutions. With a degree in Pure and Applied sciences at Champlain Regional College, and a Bachelor of Engineering degree from Concordia University, Vincent is both the author and co-author of 30+ Patents in the field of advanced semiconductor packaging. For more information please visit: linkedin.com/in/vincentdicaprio
Experienced in all facets of the technology sector, Vincent has over 30 years of outstanding achievement in Technology Development, Operations, Business, Sales and Marketing, having demonstrated success at companies like IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES. Currently leading Corporate and Business Development for the Advanced Packaging and ICAPS division at Applied Materials, he is responsible for forging new strategic alliances and partnerships key to technology advancement for future product solutions. Vincent leads all aspects of critical technology inflections related to Heterogenous Integrated, next generation integration of Silicon, volumetric scaling for all key aspects of the technology stack related to system level solutions. With a degree in Pure and Applied sciences at Champlain Regional College, and a Bachelor of Engineering degree from Concordia University, Vincent is both the author and co-author of 30+ Patents in the field of advanced semiconductor packaging. For more information please visit: linkedin.com/in/vincentdicaprio
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International Electronics Manufacturing Initiative (iNEMI) – A roadmap of value delivery to the Electronics Manufacturing Value Chain
Shrinking operating margins, complex supply chains, shorter product/ lifecycles, sustainability considerations, market demands for miniaturization and advances in product development/manufacturing drives the need for global collaboration to address not only market needs but also to solve challenging technological problems in the electronics manufacturing precompetitive space. The value of such collaborations is risk minimization of technology deployment, faster development of industry infrastructure, stimulation of relevant standards development, and dissemination of efficient business practices with a reduced time to market experienced by the electronics manufacturing ecosystem. Additionally, iNEMI members leverage to their participation to develop their engineering staff and build a robust network of technical expertise along the electronics manufacturing value chain. The International Electronics Manufacturing Initiative (iNEMI) is a not-for-profit R&D consortium of leading electronics manufacturers and suppliers, along with associations, government agencies, and universities. Its mission is to be the premier collaboration forum to forecast and accelerate improvements in the electronics manufacturing industry. iNEMI roadmaps the future technology requirements of the global electronics manufacturing industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact collaborations among our members. iNEMI membership consists of leading companies, research organizations that represent the key elements of the electronics manufacturing supply chain. These companies are focused on formulating and working on technology projects in key areas like 5G/6G communications, Advanced Packaging, Smart Manufacturing, Optoelectronics, Circular economy, and Board Assembly.
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Applied Materials
Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.
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