ISES USA 2023 Agenda

The ISES USA 2023 agenda will be released shortly.

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March 7th

March 8th

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08:00-08:10
I.S.E.S USA Opening
Welcome Address
Salah Nasri
International Semiconductor Executive Summits
President
08:10-08:30
Headline Address
Greater Phoenix: A Global Destination for Industrial Innovation
Chris Camacho
Greater Phoenix Economic Council
President & CEO
Zachary Holman
Arizona State University
Associate Professor and Director of Faculty Entrepreneurship
Darcy Renfro
Maricopa County Community College District
VP External Relations, Community, Government & Economic Development
08:30-09:00
Keynote
Advanced Packaging Ecosystem
Dr. Babak Sabi
Intel Corporation
SVP & GM Assembly and Test Technology Development
09:00-09:30
Keynote
Unleash Product Innovations with 3DFabric
Dr. Jun He
TSMC
VP Quality & Reliability and Advanced Packaging Technology & Service
09:30-10:30
Networking Break and Business Meetings
Networking Break and Business Meetings
10:30-11:00
Keynote
Advanced Packaging: Enabling Moore’s Law’s Next Frontier
Dr. Raja Swaminathan
AMD
CVP Advanced Packaging
11:00-11:10
Speaker
Processing Innovations to Address the Manufacturing Challenges of Heterogeneous Integration
Len Tedeschi
Applied Materials
VP & GM Core Packaging Products
11:10-11:30
Speaker
Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap
Oreste Donzella
KLA
EVP Electronics, Packaging and Components (EPC) Group
11:30-12:45
Lunch
Lunch
12:45-13:25
Panel Session
Heterogeneous Integration in Today's Hyper-Connected World - Moderated by Amkor Technology, Inc.
Curtis Zwenger
Amkor Technology, Inc.
VP Advanced SiP Product Development
Ahmer Syed
Qualcomm
VP Engineering
Tony LoBianco
Skyworks Solutions, Inc.
Head of Global Packaging
Deepak Kulkarni
AMD
Fellow, Advanced Packaging
Rahul Manepalli, Ph.D
Intel Corporation
Fellow, Director Substrate TD Module Engineering
13:25-13:55
Speaker
A 360 View of Semiconductor Test from AI and Security Perspective
Claudionor Coelho
Advantest
Chief AI Officer, SVP of Engineering
13:55-14:25
Speaker
Package Design and Reliability Need in Server Systems
Viresh Patel
Renesas
VP Packaging Technology
14:25-15:25
Networking Break and Business Meetings
Networking Break and Business Meetings
15:25-15:55
Speaker
Navigating Through a Correction in the Semiconductor Market
Mario Morales
IDC
Group VP Enabling Technologies and Semiconductors
15:55-16:05
Speaker
Not All Nanograined Copper Is Created Equal
Yun Zhang
Shinhao Materials
Founder & CEO
16:05-16:15
Speaker
Valuation of Artificial Intelligence for Semiconductor Equipment
Jon Hander
ASMPT NEXX
AVP Panel Products
16:15-16:25
Speaker
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Resonac
Director, Electronics Business Headquarters
16:25-16:30
Speaker
AICS Solutions to High Value Problems
Keith Best
Onto Innovation
Director, Product Marketing, Lithography
16:35-16:45
Speaker
Advanced Packaging - the need for standards
Shekar Chandrashekhar
iNEMI
CEO
16:45-17:30
Panel Session
Workforce Diversity Initiatives in the CHIPS Act
Amy Leong
FormFactor
SVP & Chief Commercial Officer
Ann Kelleher
Intel Corporation
EVP & GM Technology Development
Najwa Khazal
Edwards
General Manager, Service Technology Centers
Christine Dunbar
IQE
SVP Global Sales
Robin Davis
Deca Technologies
Director Business Development
18:00-19:00
Cocktail Reception
Sponsored by Green Technology Investments LLC (GTI)
Tal Levin
Green Technology Investments LLC (GTI)
VP Sales & Technology
19:00-21:00
Gala Dinner
Sponsored by TEL
Mark Dougherty
Tokyo Electron
President TMEA – TEL Manufacturing and Engineering of America
Industry Awards
08:00-08:30
Keynote
Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications
Thomas Sonderman
SkyWater Technology
President & CEO
08:30-09:00
Keynote
Advancing The Memory Solutions: Roadmap To Enrich Our Multi-Dimensional World For Generations To Come
Naga Chandrasekaran
Micron Technology, Inc.
SVP Technology Development
09:00-09:30
Speaker
Technologies To Break The Walls Slowing Compute Systems Scaling
Sri Samavedam
IMEC
SVP CMOS Technologies
09:30 - 10:30
Workshop
Time to Collaborate - SubFAB Research and Development
Ilya Zabelinsky
International SubFAB Research Labs Initiative (ISRL)
Founder
10:00 -10:30
Networking Break and Business Meetings
Networking Break and Business Meetings
10:30-11:00
Joint Speakers
Wall Street Perspectives on the Semiconductor Market
Tom Stokes
Evercore
Senior Managing Director
Kunal Chakrabarti
Evercore
Managing Director
11:00-11:20
Speaker
Building the Metaverse: Augmented Reality applications and integrated circuits challenges
Edith Beigné
Meta
Silicon Research Director at Reality Labs
11:20-11:40
Speaker
The New Packaging Math: 2x + 4y = 1
Wolfgang Sauter
Marvell
Customer Solutions Architect, Packaging
11:40-12:05
Speaker
Optical I/O Technology to Meet Future Demands of AI
Mark Wade
Ayar Labs
CTO, SVP Engineering & Co-Founder
12:05-12:30
Speaker
Mix and Matching Chiplets with the Economics of PCB Design
Ramin Farjadrad
Eliyan
Co-Founder & CEO
12:30-13:45
Lunch
Lunch
13:45-14:15
Panel Session
Supply Chain Panel Session - Sponsored by Airspace
Rebeca Obregon-Jimenez
Avnet
SVP Strategic Business Engagements and Supplier Management
Jackie Sturm
Intel Corporation
CVP Global Supply Chain Operations
Nana Tseng
onsemi
Chief Procurement Officer
Ryan Rusnak
Airspace
CTO
14:15-14:25
Speaker
Are New CS Markets Pushing Reliability Culture Shift?
Roland Shaw
Accel-RF, partnered with STAr Technologies
President
14:25-14:30
Speaker
Advanced Silicon Wafers for Optimized MEMS and RF Device Performance
Atte Haapalinna
Okmetic
CTO
14:30-14:35
Speaker
Advancing the Semiconductor Industry, TOGETHER
Andrew Goh
Lam Research
CVP & GM, Advanced Packaging Customer Operations
14:35-14:40
Speaker
The Future of Advanced Packaging Inspection is X-Ray
Enrico Härtel
Comet YXLON
Director Sales Electronics
14:40-15:40
Networking Break and Business Meetings
Networking Break and Business Meetings
15:40-16:10
Panel Session
Accelerating Manufacturing Transformation - Sponsored and Moderated by Deloitte
Dr. Bobby Mitra
Deloitte
Managing Director
José J. García Ph.D.
Analog Devices
Managing Director
Juan Velasquez
Skyworks Solutions, Inc.
Senior Director of Global Industrial Engineering and Automation
Maitreyee Mahajani
Western Digital
VP Fab Operations
16:10-16:40
Panel Session
Geopolitical Landscape and the Semiconductor Industry Impact
Matthew Fulco
The Economist Intelligence Unit
Business & Political Journalist
Prof. Rao Tummala
Georgia Tech University
Distinguished and Endowed Chair Professor & Director Emeritus
Mario Morales
IDC
Group VP Enabling Technologies and Semiconductors
Sunil Banwari
iontra
COO
16:40 - 16:50
Closing Address
Closing Address
Salah Nasri
International Semiconductor Executive Summits
President

March 7th

March 8th

ISES USA 2023

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