ISES USA 2024 Agenda

The ISES USA 2024 agenda will be released shortly.

April 2nd

April 3rd

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Advanced Packaging
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07:00 – 08:15
Registration
10:10 – 11:10
Networking Break & Business Meetings 1+2
11:15 – 11:45
Keynote
HPC, AI, Chiplets, heterogeneous integration
12:40 – 13:55
Buffet Lunch
14:00 – 14:20
Speaker
Optimizing Cost and Quality Through Test Mobility Across Insertions
14:50 – 15:50
Networking Break & Business Meetings 3+4
15:55 – 16:10
Speaker
Challenges to enabling the transition from organic to glass core substrates as RDL approaches 2 µm l/s and beyond
16:15 – 16:25
Speaker
Co-Packaged Optics and Solutions for High Volume manufacturing
16:30 – 16:40
18:00 – 19:00
Cocktail Reception
08:30 – 08:50
09:20 – 09:30
Speaker
Advanced Packaging/Substrate Materials and Open innovation Platform
09:35 – 09:45
Speaker: Applied Materials
Enabling the Next Generation of Scaling for Advanced Substrates
09:50 – 10:10
Speaker
New Process as Solutions for Substrates Production
10:00 – 10:10
10:15 – 11:15
Networking Break and Business Meetings 5+6
11:20 –11:40
Speaker
Semiconductor Market Outlook: Investment and Innovation Accelerate Next Growth Cycle
12:25 – 13:40
Buffet Lunch
13:45 –13:55 Reserved
Speaker
14:40 – 15:40
Networking Break and Business Meetings 7

April 2nd

April 3rd